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smt贴片查验规范

Release Time:2020-11-09 Edit the author:金致卓 Reading:3219

   本文对于SMT贴片加gong工艺查验规范,以下是具体内容:


  一、SMT贴片锡膏工艺

  1.PCB板上印刷的喷锡的地位与焊盘居中,无ming显的偏移,不可影响SMT元件粘贴与上锡效guo。


  2.PCB板上印刷喷锡量适中,不能完全的笼盖焊盘,少锡、漏刷。


  3.PCB板上印刷喷锡点成形不良,印刷喷锡连锡、喷锡成高低不平状,喷锡移位超焊盘三分之一。


  二、SMT贴片红胶工艺

  1.印刷红胶的地位居中,无ming显的偏移,不能够影响粘贴与焊锡。


  2.印刷红胶胶量适中,能杰出的粘贴,无欠胶。


  3.印刷红胶胶点偏移两焊盘中心,能够形成元件与焊盘不易上锡。


  4.印刷红胶量过量,从元件体侧上面排泄的胶的宽度大于元件体宽的二分之一。


  三、SMT贴片工艺

  1、SMT元器件贴装需整洁、正中,无偏移、倾斜。


  2、SMT元器件贴装地位的元器件型号规格应准确,元器件应背面。元器件贴反(不许可元件有区分的绝对称的两个面交换地位,如:有丝印标识的面与无丝印标识的面高低倒置面),功效没法完成。


  3、有极性请求的贴片元器件贴装需按准确的极性标示加工。器件极性贴反、毛病(二极管、三极管、钽质电容)。


  4、多引脚器件或相邻元件焊盘应无连锡、桥接短路。


  5.多引脚器件或相邻元件焊盘上应无残留的锡珠、锡渣。

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